MCM is short for multi-chip-module, MCM is an electronic assembly include integrated circuits, semiconductor dies and other discrete components. Because it is based on the HIC technology, it can be treated as a lager integrated circuit.
Compared with traditional PCB technology, multi-chip-module with less welding spot, adopt hermetic packages, it can improve the circuits performance, increase the subassemblies density, and decrease the volume and weight. With MCM technology, we can design and produce many products, such as big scale digital-analog hybrid integrated circuit module, high temperature NAND/NOR type flash memory, high temperature linear power supply, etc.
ZITN self-developed the first big scale 11 layers digital-analog hybrid integrated circuit module with HTCC technology, and the max operating temperature can meet 200℃.
How to produce the MCM?
Today, I would like to discuss about multi-chip-module production process with you.
A. Printing and sintering on the ceramic substrate.
Printing conductor paste, thick film resistor paste, vitreous glaze paste, and dielectric paste on the ceramic substrate, then proceed the high sintering, and laser trimming processes, form the film-forming substrate.
B. Shell and tube combined.
Ceramic substrate, metal shell and tube combined together.
C. Component patch
Chip electronic component and IC installed on the ceramic substrate by chip mounter.
Bonding by automatic bonding equipment.
E. Hermetic packaging
Hermetic packaging can prevent corrosion.
Above are important production processes for MCM technology. Besides, there are many kinds of package shells to choose from.
ZITN designs and develops MCM technology for 20 years, adhering to the core values of "integrity, focused, innovative,win-win", we got good reputation on the market and keep good relationship with many customers these years.
If you have any intention, contact us anytime.
Contact us:
Email: info@qdzitn.com
Web: www.zitnmicro.com
